Glass Wafer Slicing Machine
The SG 20 is a high-precision gantry-structured wire saw specifically designed for slicing small optical glass, crystal, and ceramic parts. With a fully enclosed structure, touchscreen interface, and automatic thickness control, it delivers exceptional performance for both R&D and small-scale production.
KEY FEATURES
1. High-Precision Slicing for Small Workpieces
Capable of slicing parts up to 200 × 200 × 220 mm, the machine uses an endless diamond wire (Ø0.3–1.0 mm) to achieve clean, low-damage slicing of hard, brittle, or high-value materials.
2. Dual Slicing Modes: Equal & Variable Thickness
Operators can choose between consistent-thickness mode and custom-thickness slicing for up to 10 different layers in one job.
3. Fully Enclosed Gantry Structure
Compact but sturdy gantry-style frame with full safety doors allows safe and quiet operation while reducing contamination and splash.
4. Intelligent Cutting Control System
Touchscreen + button-based control interface supports:
Kerf compensation
Peeling vs. non-peeling modes
Real-time slice thickness setting
Wire break detection and alarm
Production tracking and auto shutdown
5. Auto Lubrication & Fluid Cooling
Equipped with a water circulation system and automated lubrication system to ensure clean cutting conditions and reduced wear.
6. Oil Mist Collection Support
Compatible with optional oil mist recovery units for cleaner lab and production environments.
| No. | Name | Specification |
| 1 | Maximum Workpiece Length (mm) | 200 |
| 2 | Maximum Workpiece Width (mm) | 200 |
| 3 | Maximum Workpiece Height (mm) | 220 |
| 4 | Worktable Y-Axis Travel (mm) | 200 |
| 5 | Worktable Z-Axis Travel (mm) | 220 |
| 6 | Maximum Diamond Wire Speed (m/s) | 58 |
| 7 | Minimum Feed Increment Y-Axis (mm) | 0.01 |
| 8 | Minimum Feed Increment Z-Axis (mm) | 0.01 |
| 9 | Repeat Positioning Accuracy Y-Axis (mm) | 0.01 |
| 10 | Repeat Positioning Accuracy Z-Axis (mm) | 0.01 |
| 11 | Total Power Consumption (kW) | 1.5 |
| 12 | Power Supply | 220V 50Hz |
| 13 | Machine Size(mm) | 1044*943*1810 |
| 14 | Machine Weight(kg) | 400 |
When slicing small, brittle materials like optical glass or ceramics, cutting precision and surface quality are critical. Here’s how the SG 20 stacks up against two commonly used cutting machines in labs and factories:
| Feature / Method | SG 20<br>Diamond Wire Saw | ID Saw<br>(Inner Diameter Saw) | Band Saw |
|---|---|---|---|
| Cutting Precision | ⭐⭐⭐⭐ ≤ 0.05 mm | ⭐⭐⭐⭐ High | ⭐ Low |
| Surface Quality | ⭐⭐⭐⭐ Smooth, chip-free | ⭐⭐⭐ Good (may need polishing) | ⭐ Rough, high chipping |
| Slice Thickness Control | ⭐⭐⭐⭐ Programmable + multi-thickness | ⭐⭐ Manual setup per thickness | ❌ None |
| Kerf Width | ⭐⭐ 0.3–0.6 mm | ⭐ 0.15–0.3 mm | ❌ >1.0 mm |
| Operation Simplicity | ⭐⭐⭐⭐ Touchscreen + auto feed | ⭐⭐ Requires trained technician | ⭐ Very basic |
| Tool Life & Cost | ⭐⭐ Mid | ❌ Blade wear costly | ⭐⭐ Low cost |
| Material Adaptability | ⭐⭐⭐⭐ Glass, ceramics, crystals | ⭐⭐ Thin wafers, specific sizes | ⚠️ Coarse blocks only |
| Automation Support | ✅ Full automatic slicing | ❌ Manual step-by-step | ❌ No automation |
Optical Glass Slicing
Used to cut filter glass, wavelength-selective windows, laser optics blanks, and protective glass substrates in small batches or R&D setups.
Ceramic Material Preparation
Perfect for slicing alumina, aluminum nitride, or sintered ceramics for electronic packaging, thermal insulation, or RF components.
Crystal Cutting
Enables accurate slicing of quartz plates, YAG blanks, or other photonic crystals for subsequent polishing or dicing.
Research Sample Preparation
Popular in academic labs for creating test pieces from hard or brittle materials with controlled thicknesses—supporting multi-slice, kerf-compensated, and peeling modes.
What is the maximum thickness the machine can handle for cutting?
What is the difference between this wire saw and BAND SAW?
The cutting speed would be similar, but wire saw’s cut surface quality is far more better. and the kerf loss is smaller.